MIL-O-81151A(OS)
The phase shall meet the requirement set forth in 3.4.5.
4.4.4.10.8 Remove the EPUT leads from pins 1 and 7 of the oscillator
subassembly, remove all power.
4.4.4.11 Visual and dimensional examination. Each oscillator shall be
examined to deter-mine conformance with the requirements for workmanship and
dimensions.
4.4.4.12 Packaging, packing, and marking. Packaging, packing, and
marking shall comply with the requirements of Section 5.
4.5 Reproduction and periodic production inspection. The preproduc-
tion and periodic production samples, after satisfactorily passing the
quality conformance inspections detailed in 4.4, shall be subjected to
the following tests and examinations. Certified inspection data covering
the results of preproduction and periodic production inspections shall be
forwarded to t-he procuring activity.
4.5.1 Vibration
4.5.1.1 Mounting. The oscillator assembly, less pack or packaging,
shall be mounted to a test fixture as shown in Figure 2 and tested as
specified in 4.5.1.2 and 4.5.1.3.
4.5.1.2 Vibration, nonoperating. The oscillator subassembly shall be
subjected to the "Vibration, nonoperating" test of MIL-E-82590 and there-
after shall meet the requirements of 3.5.1.1.
4.5.1.3 Vibration. operating. The oscillator subassembly shall be
subjected to t-he "Vibration, operating" test of MIL-E-82590 and during and
thereafter shall meet the requirements of 3.5.1.2.
4.5.1.4 Vibration, transportation. The oscillator subassembly shall be
subjected to the "Vibration, transportation" test of MIL-E-82590 and there-
after shall meet the requirements of 3.5,1.3.
4.5.2 Shock, transportation. The oscillator subassembly shall be sub-
jected to the "Shock, transportation" test of MIL-E-82590 and thereafter
shall meet the requirements of 3.5.2.
4.5.3
Temperature and humidity
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